IC Package Development Engineer at Micron

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Package Development & Engineering Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments. Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems. Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness. Analyze engineering data, identify risks, document findings, and recommend technically sound actions. Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives . Design, CAD & EDA Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables. Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, documentation, and release activities. Work with multidisciplinary teams to resolve design, manufacturability, performance, and data-quality issues. Support engineering standards, reusable design methods, templates, and best-known methods. AI, ML & Automation Develop automation for repetitive design, simulation, data-processing, validation, reporting, and engineering workflow activities. Build or contribute to AI/ML models for design validation, optimization, prediction, anomaly detection, and simulation acceleration. Create engineering assistants, copilot agents, dashboards, and data pipelines that improve decision speed and traceability. Translate engineering challenges into scalable digital solutions with appropriate validation , documentation, security, and human oversight. Measure s